1) RF front-end circuit design: RF front-end circuit design is a crucial part for any wireless communication including space communication. Among the works on different RF Technologies, we have major focus on the RF front-end circuit design. We have expertise in both the transmitter and receiver block design. We have developed various RF front-end modules, such as power amplifiers, low noise amplifier, mixers, and circuits for mm-Wave and THz. Some of them are already delivered to the funding agencies. This designed ICs are fabricated using the upcoming fabrication technologies like GaAs/GaN, RF CMOS, HEMT, etc. We also have complete RF chip characterization facilities up to mm-wave technologies. Our group is also collaborated with various funding agencies for indigenous design of GaN/GaAs devices for RF Technologies.

2) Antennas: Our group is extensively working on state-of the art antennas required for RADAR and satellite communication, recent wireless technologies, 5G communication, and wireless sensor for IoT. We have expertise in both the antenna designing and its feeding techniques. Depending upon the applications we design various antennas, such as narrow beam antennas using horn and reflect array for satellite communication, phased array antennas for producing multiple beams and beam steering, MIMO antenna with omni-directional pattern diversity, reconfigurable antennas for beam switching and frequency tunability, plasmonic antennas for THz communication, meta-surface-based antennas for miniaturization and enhanced performance, to name a few. We have the in-house facilities from designing an antenna system to its fabrication and characterization.

The group is actively involved with various national labs like ISRO, DRDO, CSIR, and industries, such as BEL, RailTel, VML, Raksha supreme, etc. Moreover, we have strong collaboration with international institutes, such as KIT in Germany, IMRIA in France, Florida state University, and University of Michigan in USA, University of Tokyo in Japan.

1. Anechoic Chamber
2. Common Research Technology Development Hub
3. On-chip RF characterization
4. PCB Prototyping